Semiconductor Manufacturing Technology II

6/14/1999


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Table of Contents

Semiconductor Manufacturing Technology II

Objectives

Topics of Discussion

What is plasma

Ionization Rate

Generation of a Plasma

Ionization

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Excitation-relaxation

Dissociation

Mean free path (MFP)

Ion bombardment

PPT Slide

Plasma Potential & DC Bias

DC Bias and RF Power

DC Bias of CVD Chamber Plasma

PPT Slide

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DC Bias of Etch Chamber Plasma

Benefits of Using Plasma For CVD Process

PPT Slide

Schematic of an Etch Chamber

Magnets

Schematic of high density plasma sources: ICP, ECR and helicon

Summary

 Author: Hong Xiao

Email: hxiao@austin.cc.tx.us

Home Page: http://www2.austin.cc.tx.us/HongXiao