Week 3

09/11 What is semiconductor, Review of semiconductor devices Read Chapter 2 and 3

Week 4

09/18 MOS process flow I. Class Notes

Week 5

09/25 MOS process flow II. Class Notes

Week 6

10/02 Making wafer, epi silicon deposition Read Chapter 5

Week 7

10/09 Review and Test1.

Week 8

10/16 Thermal Processes, epi- and poly silicon and nitride deposition, Read Chapter 7.Chapter 12, page 372 to 380

Week 9

10/23 Basic plasma

Week 10

10/30 CVD II, dielectric. Read Chapter 12.

Week 11

11//06 Review and Test 2

Week 12

11/13 Metallization 1 Read Chapter 13

Week 13

11/20 Metallization 2. Read Chapter 13

11/22, last day to withdraw

Week 14

11/27 CMP

Week 15

12/04 Review

Week 16

12/11 Final Exam

Student Responsibilities:

Attendance is critical. Not all materials covered in the class will be in the textbook. This class is designed to be an interactive exchange between instructor and class participants. What you learn and are tested on will be based upon class discussions and class notes. Tests cannot be “made up” unless prior arrangements are made with the instructor if an emergency occurs. Late tests will receive an automatic deduction of 10% of test score while no punishment for early test. Students are expected to prepare for each class session by reading the assigned materials prior to the class in which they will be discussed. If anyone fells unable to achieve the desired grade for this class for any reason or reasons, be advised that the last day to drop from the class is November 22. Fail to drop may result an F in the final grade which will be on ACC record forever.

Reference Texts:

· Semiconductor Manufacturing Technology, by Hong Xiao

Course Performance Measurements:

Test 1 = 30% of final grade

Test 2 = 30% of final grade

Final Exam = 40% of final grade

One "cheat sheet" is allowed for the tests and final exam.

Extra credit project:

Available upon request in person, on first come first serve base.