instructor: john tiede | email: tiede@austincc.edu

Fabrication is accomplished with Processes using Maerials

MEMS can be fabricated using a wide range of materials and processes. The 50 year old Semiconductor industry has provided a rich library of technologies that transfer rather nicely to MEMS fabrication. Rather than using the electric properties of materials, MEMS uses the mechanical properties of the materials. MEMS has added to these existing processes and materials to expand the capabilities. Aging IC FABS, that are no longer competitive are perfect for MEMS fabrication and gain a new life.

Materials

Silicon Family - strong, light, semiconductor

Silicon Forms - crystalline, polycrystalline, amorphous, oxide, nitride, carbide

Metals - aluminum, titanium, tungsten, copper

Polymer coatings - photoresist

Processes

Deposition
- spin-on, epitaxy, oxidation, sputtering
- CVD, LPCVD, PECVD

Patterning
-optical lithography

Etching
- isotropic, anisotropic, plasma
- wet, dry

Dominate Technologies

Surface Micromachining - etching of structural and sacrificial

Bulk Micromachining - etching of bulk silicon

LIGA (lithographie,galvanoformung,abformung) - injection molding of
ceramics and polmers